Abstract
• 1946 - First reports of nickel electroless process [000]
• Presently, deposits of Ni−P: (W, Mo, Co) and Ni−B are used in
automotive, chemical, aerospace, oil & gas, electronic and
textile fields as well as to improve medical instrumentation [1–4]
• Two commercial processes to deposit Ni−B electroless coaLngs:
one uses borohydride and the other dimethylamine borane
(DMAB) as the reducing agents. The structural characteristics
idenLfied in the Ni−B coaLngs depend on the B content:
a) if content is < 2wt.%, microstructure consists of a solid solution of boron into
microcrystalline nickel with columnar structure;
b) if content is between 2 and 6wt.% a mixture of microcrystalline and amorphous
phases are formed,
c) if content is ~ 6wt.% the coating becomes totally amorphous.
•With thermal treatments hardness on Ni−B coaLngs can be
similar to that of hard chromium with high wear resistance. The
only reported disadvantage is a corrosion resistance slightly
smaller than Ni−P alloys [5-9]
•Heat treatment improves hardness and the adhesion of Ni–B
deposited on steel [10]
• Further improving the electroless Ni-B coating conditions are
compared in wear tests versus hard chromium, electroless Ni-P,
cubic boron nitride, and titanium nitride, reporting lower wear
and a lower COF [7,11–14]
•In previous research, electroless Ni-B baths are usually prepared
with more than four reagents, and in a great majority they use
heavy metal salts (Pb and Ta) as a bath stabilizer.
• Health regulations and environmental these last salts are being banned.
•In this work we use a bath of four components, easy to control
and relatively low temperature (65°C), no stabilizers based on
heavy metal salts are used, and the bath is very stable.
Original language | English |
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Number of pages | 1 |
Publication status | Published - 16 Apr 2019 |
Event | Wear of Materials Conference - Duration: 1 Jun 2017 → … |
Conference
Conference | Wear of Materials Conference |
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Period | 1/6/17 → … |
All Science Journal Classification (ASJC) codes
- Control and Systems Engineering
- Software
- Mechanical Engineering
- Computer Science Applications
- Industrial and Manufacturing Engineering